Engineer (*) for process development and integration, focus on dry etching

RF360 Europe GmbH, a Qualcomm company, is a driver of innovation in the field of the Radio Frequency Front End (RFFE). With more than 4,500 employees worldwide, RF360 develops and manufactures advanced RFFE filter solutions for mobile devices and rapidly growing business areas such as IoT, robotics, automotive electronics and more.

We are looking for one for our Wafer Level Packaging department in the area of technology development in Munich

Engineer (*) for process development and integration

• Process development and process integration in the area of advanced wafer level packaging in an international team
• Development and evaluation of innovative processes and systems in the field of dry etching
• Support for new technologies in a MEMS production
• Characterization of materials, processes and plants with analytical and statistical methods

• Successfully completed studies in the areas of physics, microsystem technology and / or process technology (diploma / master)
• Experience with procedures / processes for the production of electronic components
• Practical experience with dry etching processes
• Knowledge of various physical and chemical analysis methods
• Goal-oriented, structured, reliable and independent way of working
• Decision-making and communication skills;
• Very good knowledge of German and English
• Willingness to travel

• an attractive overall package within the framework of the collective agreements of the Bavarian metal and electrical industry
• an employer-financed pension scheme
• an employee share program
• intensive familiarization
• a modern canteen for a balanced and healthy diet according to the quality standards of the German Nutrition Society (DGE) and
• an excellent central location in Munich near Ostbahnhof / factory district.